OS7700｜Open Short Tester (After Wire Bond)


Package Size
  1. Package Size：
    PBGA 5x5~40x40mm
Product Type
  1. PBGA / Matrix PBGA
Application
  1. After Wire Bonding open short tester machine
Machine Function
  1. Using Smart Open Short test system, standard I/O 1024 Pin
  2. The height of the test machine can be expanded to 2048 Pin
  3. Test speed per Pin 2ms
  4. Double channel dual area test, channel width Max. 95x240mm
  5. Minimum test solder ball Pitch 0.4mm, Solder Pad Min. 0.2mm
  6. With defective product re-test function
  7. Defective product mark has been represented by Map
  8. Use CCD to visually correct the alignment between Pogo Pin and substrate
  9. Use the quick-release one touch kit, and the machine change time is within 20 minutes
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